SUIT shines at Hi‑Tech Fair

Shenzhen University of Information Technology (SUIT) made a strong impression at the 27th China International Hi‑Tech Fair (CHTF), one of the country’s largest technology exhibitions, which concluded Sunday in Shenzhen.

The university earned two collective honors — the “Excellent Exhibition Award” and the “Excellent Organization Award” — and took home 20 “Excellent Scientific Research Achievement Innovation Awards,” SUIT said in a statement yesterday.

SUIT exhibits major technical breakthroughs at the 27th China International Hi‑Tech Fair (CHTF). Photos courtesy of SUIT

SUIT presented 23 collaborative projects developed by faculty, students and industry partners across fields including artificial intelligence, big data, intelligent manufacturing, medical devices and digital cultural creativity.

Several exhibits showcased major technical breakthroughs: a chirped reflector for femtosecond lasers and a large‑scale SoC testing system that address core technology challenges and substantially improve testing efficiency and reliability for domestically produced chips. A confocal laser speckle blood‑flow imager and a fully domestic information‑technology drone security automatic inspection system represented first‑of‑their‑kind achievements in China, highlighting SUIT’s forward‑looking strategy and problem‑solving capacity.

Market‑ready products and solutions drew strong industry interest. School‑enterprise collaborations, such as a small aviation turbine‑electric engine and unmanned inspection and disinfection vehicle systems, generated numerous business inquiries. Faculty‑student innovations, including a cultural‑tourism metaverse project and a gateway security guardian for data and risk monitoring, were noted for both creativity and practical value. Community support initiatives, such as “Huiyan,” a large‑model‑based digital identification system for Chinese agricultural pests and diseases, underscored the university’s commitment to rural revitalization and social responsibility.

SUIT teams engage in intensive technical exchanges with participating firms.

During the CHTF, SUIT teams engaged in intensive technical exchanges with participating firms, highlighting the commercial viability and application potential of the university’s research.

SUIT Party Secretary Miao Ningli said that the exhibits reflect four clear trends in the university’s research efforts: an increasing number of industry‑convertible projects, deeper collaboration with companies, more projects led by young teachers, and greater student participation.

Miao said SUIT will use its CHTF experience to deepen industry‑education collaborative innovation, accelerate the conversion of research into productive forces, and continuously optimize the innovation ecosystem so that more faculty and students succeed in research and innovation.

Organizers and university leaders described SUIT’s showing at the CHTF as both validation of the university’s past efforts and the start of a new phase of high‑quality development. Going forward, SUIT plans to focus on high‑tech industry development in the Guangdong‑Hong Kong‑Macao Greater Bay Area, strengthen mechanisms for industry‑education integration, and drive regional industrial upgrading and the construction of a modern vocational education system through the twin engines of research and talent development.

This year SUIT was newly promoted to a vocational undergraduate university and enrolled about 6,000 new students from across the country in September. The university launched its first group of five vocational undergraduate programs — Software Engineering Technology, Modern Communication Engineering, Integrated Circuit Engineering Technology, Intelligent Manufacturing Engineering Technology, and Embedded Technology — programs designed to align closely with the emerging industries of Shenzhen and the Guangdong‑Hong Kong‑Macao Greater Bay Area.