The final of the 2018 China Heyuan International Mobile Innovation and Entrepreneurship Competition was held in Heyuan, Guangdong Province, on Monday.
Since its launch July 18, the competition has been on for five months with 90 projects across the various divisions standing out from the over 500 competitors to move on to the semi-final. Twelve of these projects earned tickets to the final.
The high-performance 4G, 5G, and the RF front-end chip and modules for Internet of Things won first prizes. The three runners-up were a VCSEL chip with high efficiency for 3D imaging, a Wi-Fi chip with very low power consumption and a small base station radio frequency chip for IoT application, and an LTCC Beidou chip antenna. Third place prizes went to a force transducer, SENGAZ, an intelligent digital mobile terminal, a project that has designed a new ecology for the Internet wholesaling, a printed power-free gas sensor chip and Outsense.
The competition has nine divisions, including three overseas divisions in North America, Germany and Israel and six domestic divisions in North China, East China, Central China, Northeast China, Northwest China and the Guangdong-Hong Kong-Macao Greater Bay Area. A total of 942 projects signed up for the competition and 545 were approved, of which 173 are from overseas divisions.
Wang Wei, vice mayor of the city, said in a speech before the final that he hoped the competition would inject fresh impetus into the growth of Heyuan’s innovation and entrepreneurship and quicken the pace of Heyuan, making contributions to the development of the Greater Bay Area into an international scientific, technological and innovative center.
The mayor of Heyuan, Ye Meifen, said during the award ceremony that she welcomes top entrepreneurship teams, enterprises and individuals to settle in the city and hopes government departments at all levels will offer generous support and favorable policies to these enterprises.