A team from the Silicon Valley, the U.S., won the first prize of 1 million yuan (US$151,400) at the 4th China (Shenzhen) International Innovation & Entrepreneurship Competition that ended in Longgang District on Friday.
The 3D Visual All Stack Solutions innovatively applied nanometer and optics technologies in the 3D visual fields, the expert committee said in the appraisal.
The technologies and application of mixed reality under 5G network and Novi artificial intelligence and genomic technology program won the second prize.
Due to COVID-19, the competition this year was held online. In the past seven months, 1,047 projects from 53 countries participated in preliminaries in Madrid, Sydney, Toronto, Berlin, Tokyo, Silicon Valley and London, competing for qualifications in professional contests in the Internet of Things, and artificial intelligence sectors and industry contests in the Internet, advanced manufacturing, electronic technology, biology and life sciences, and materials and energy industries.
Seventeen projects in the preliminaries entered the final overall contest in Longgang District, where contestants showed their projects via videos. The organizer, Shenzhen Municipal Human Resources and Social Security Bureau, offered 9.83 million yuan in awards for the whole contest from overseas preliminaries to the finals in China.
Among the contestants, 751 of them were foreign participants and 1,259, or 90 percent, had a master’s degree or higher. Nearly 60 percent of them had doctorate degrees. The contestants owned up to 655 patents or other intellectual property rights (IPRs).
In the 1,047 projects that had signed up for the contest this year, 302 of them, or 28 percent, came from the electronic technology industry. A total of 301 projects signed up for the contests in the Internet of Things and artificial intelligence.
Electronic technology and AI are among the city’s primary strategic emerging industries and the projects will invigorate the vitality of the city’s industrial upgrading.